EDADOC PCB Manufacturing－2-68 Layers Prototype

PCB Design SI/PI Analysis PCB Manufacturing SMT Welding Component Selection

PCB Manufacturing Board Making Advantages Technical Capabilities Product Display

PCB Manufacturing

We specialize in the manufacture of high speed and multi-layer circuit boards, with factories located in the center of the high-tech hub, Pearl River Delta (China’s Silicon Valley). Our products span multiple industries, such as Industrial Control Systems, Communications Equipment, Automobile Equipment, Medical Devices, and more.

· IATF16949, UL, ISO9001, ISO14000/and other series certifications

· TPS (Toyota Production System) lean production management system

· One-stop EMS service: PCB Design, PCB Manufacturing, SMT,

Component Sourcingpply

Board Making Advantages

Prototype, small and medium batch, mass production of PCBs

FR4, M4, M6, TU862, TU872, IT968, etc.

Fast delivery and on-time delivery

UL certification, IATF 16949 certification, ISO9001, ISO14001

Technical Capabilities

Process Parameters

Project	Process parameters
Layer	2-68 L
Board Thickness	0.5-17.5mm
Finished copper thickness	0.3-12 oz
Min drill hole size	0.1mm
Minimum laser via size	0.075mm
HDI Type	1+n+1、2+n+2、3+n+3
Max Aspect Ratio	20:1
Max board size	650mm*1130mm
Min width & space	2.4/2.4mil
Min Outline Tolerance	±0.1mm
Impedance Tolerance	±5%
Min PP Thickness	0.06mm
Bow & Twist	≤0.5%
Materials	FR4、Hi-Tg FR4、Rogers、Nelco、RCC、PTFE M4、M6、TU862、TU872、IT170GRA1、IT968
Surface Finished	HASL/HASL Pb Free/Immersion Gold/Tin/Silver OSP/ Immersion Gold + OSP
Special Capability	Buried blind via, Step groove, Metal board,Buried resistance and capacitance Mixed pressure, flex board, back drill, Gold finger buried resistance and capacitance

Production Cycle

Number of layers	Batch	Template	Urgent
2L	9days	5days	48h
4L	10days	5days	3days
6L	12days	6days	3days
8L	12days	7days	4days
10L	14days	10days	4days
12L	14days	10days	5days
14L	16days	12days	6days
16L	16days	12days	6days
18L	18days	14days	6days
20L	20days	14days	8days
22L	20days	14days	8days
24L	20days	14days	8days
26L	20days	14days	10days
28L	20days	14days	10days
30L	20days	14days	10days
32L	20days	14days	10days

Note: This delivery time does not include the engineering processing time. Typically 1 day. Please contact our staff for the specific delivery time.

Product Display

ENIG board

·Number of layers: 10

·Board material: FR4

·Board thickness: 1.8mm

·Surface finish: ENIG

·Soldermask: Blue

Data communication board

·Number of layers: 18

·Board thickness: 2.4mm

·Surface finish: ENIG

·Minimum line width/ line distance: 3/3mil

·Soldermask: Green

HDI board

·HDI type: 3 + 4 + 3

·Surface finish: ENIG

·Minimum line width/ line distance: 2.4/2.4mil

·Minimum medium thickness: 2.2mil

·Soldermask: Green

Backboard

·Number of layers: 28

·Board material: HI-TG FR4

·Board thickness: 5.0mm

·Surface finish: ENIG

·Soldermask: Green

Radio-frequency board

·Number of layers: 8

·Board material: FR4, Rogers Ro4003

·Board thickness: 1.6mm

·Surface finish: ENIG

·Soldermask: Green

HDI board

·Number of layers: 10

·Board thickness: 1.2mm

·Surface finish: ENIG

·Minimum line width/ line space: 2.4/2.4mil

·HDI type: 1+4+1

Flex-rigid board

·Number of layers: 12

·Board thickness: 1.6mm

·Surface finish: ENIG + selective tin spraying

·Minimum line width/ line space: 4/4mil

·Other process: Blind and buried vias, blue glue